3D Glass Solutions Bhubaneswar 3DHI Packaging Unit

Overview

India's first advanced 3D chip-packaging unit, being built at Info Valley, Bhubaneswar, Odisha by Heterogeneous Integration Packaging Solutions Pvt Ltd -- the India venture of USA-based 3D Glass Solutions. Approved under the India Semiconductor Mission in the four-unit batch cleared by the Union Cabinet on 12 August 2025, at a cost of about Rs 1,934 crore (~US$0.23 billion), it is the only one of the ISM-approved projects to date that represents truly advanced packaging. The facility uses glass substrates instead of silicon and 3D Heterogeneous Integration (3DHI) to stack components vertically for artificial-intelligence, 5G, defence and data-centre applications. Its planned output is roughly 70,000 glass panels, 50 million assembled units and 13,000 advanced 3DHI modules per year. Investors include Intel and Lockheed Martin. The foundation stone was laid on 22 April 2026; a production-start date has not been disclosed. Key facility details include: The facility is situated at Info Valley, Bhubaneswar, Khordha District, Odisha, India. It focuses on Advanced Packaging, Assembly & Packaging. This site represents an estimated investment of $0.23B.