ASIP Technologies Visakhapatnam OSAT

Overview

An outsourced semiconductor assembly & test (OSAT / advanced-packaging) plant being built by ASIP Technologies at Tarluvada, Visakhapatnam, Andhra Pradesh -- the state's first semiconductor manufacturing facility. PM Narendra Modi laid the foundation stone virtually on 1 August 2026. The 30-acre plant carries a total project value of about Rs 2,500 crore (~US$260 million), split between an initial ~Rs 460 crore (~US$48 million) and a planned ~Rs 2,000 crore (~US$210 million) expansion. It targets an annual capacity of 96 million chips for AI, high-performance-computing, data-centre and high-speed-communication customers, starting with wire-bond and Flip-Chip Ball Grid Array (FCBGA) packaging and adding 2.5D and 3D advanced packaging within two to three years. South Korea's APACT is the technology partner. Volume production is targeted for the fourth quarter of 2027. Key facility details include: The facility is situated at Tarluvada, Visakhapatnam, Andhra Pradesh, India. It focuses on Advanced Packaging, Assembly & Packaging. This site represents an estimated investment of $0.26B. Production at this facility is expected to begin in 2027.