Reutlingen Campus

Overview

The Reutlingen site is Bosch's longest-standing semiconductor manufacturing center, producing automotive ICs since 1970, MEMS sensors in volume since 1995, and SiC power semiconductors since 2021. 150mm wafer manufacturing began in 1995 and 200mm in 2010; the site completed its transition to a pure 200mm silicon and SiC fab by 2026, with 44,000 m2 of cleanroom and highly automated production for structures down to 180nm. Bosch and the German federal/state governments have committed roughly EUR 3 billion combined across Reutlingen and Dresden through the end of 2026, partly via the IPCEI ME (Important Project of Common European Interest on Microelectronics) program; the specific per-site split is not publicly broken out. Key facility details include: The facility is situated at Tübinger Str. 123, 72762 Reutlingen, Germany. It focuses on Analog / Power, MEMS, Compound Semiconductor and 180 process nodes on 200mm wafers. Production at this facility commenced in 1970.