Overview
Carsem (M) Sdn Bhd is a Malaysian outsourced semiconductor assembly and test (OSAT) provider, established in 1972 and one of the world's largest by unit volume. It is a subsidiary of Malaysian Pacific Industries (MPI, Bursa Malaysia 3867) under the Hong Leong Group. Carsem offers one of the broadest turnkey package-and-test portfolios in the industry -- ball grid array (BGA), quad flat packages (QFP), QFN/leadless leadframe families, SOIC, MEMS sensor and flip-chip packages -- together with full electrical test. Its main operations are three factories in Ipoh, Perak, Malaysia (about a 90-minute drive from Penang), complemented by the Carsem Suzhou and Carsem Suxiang plants in Jiangsu, China (in production since 2004) and, from 2026, a plant in Nonthaburi, Thailand. The company employs roughly 9,000 people and assembles in excess of 100 million units per week, more than 65 percent of which is fully electrically tested. As a back-end assembly and test house it has no wafer-fab process node; per-facility monthly wafer capacity is not a fab metric and plant cost is not disclosed. Key facility details include: The facility is situated at Ipoh, Perak, Malaysia (three factories; HQ of Carsem (M) Sdn Bhd). It focuses on Assembly & Packaging. Production at this facility commenced in 1972.