Chipbond Technology - Hsinchu Science Park

Overview

Chipbond Technology Corporation (Taipei Exchange 6147) is a Taiwanese outsourced semiconductor assembly and test (OSAT) company founded in July 1997 (initial capital NT$300 million) and listed on the over-the-counter / Taipei Exchange market in 2002. An early pioneer of wafer bumping in Taiwan, it is the world's largest packaging and test facility for display-driver ICs and the only Taiwanese company offering a full turnkey back-end flow for LCD/OLED driver ICs -- gold and solder wafer-level bumping, wafer probing, Chip-on-Film (COF), Chip-on-Glass (COG) and wafer-level chip-scale packaging -- serving display, wireless, power-management, automotive and biomedical customers. It operates the LiHsin and Prosperity plants within the Hsinchu Science Park (HQ at No. 3, Li Hsin 5th Rd.). As an OSAT it has no wafer-fab process node, and per-facility monthly wafer capacity and plant cost are not disclosed. Key facility details include: The facility is situated at No. 3, Li Hsin 5th Rd., Hsinchu Science Park, Hsinchu, Taiwan (LiHsin and Prosperity plants). It focuses on Assembly & Packaging, Advanced Packaging. Production at this facility commenced in 1997.