Overview
A planned 8-inch (200mm) gallium-nitride-on-silicon-carbide (GaN-on-SiC) wafer fabrication facility that Dublin (Ireland)-based semiconductor and photonics company CHIPX intends to build in Malaysia. Announced on 15 December 2025, CHIPX describes it as the ASEAN region's first 8-inch GaN/SiC wafer fab and Malaysia's entry into front-end semiconductor manufacturing. The plant targets next-generation transceivers and receivers, ultra-high-speed connectivity and high-bandwidth optical interconnects for AI data centres, plus photonics and advanced-materials engineering. CHIPX is pursuing the venture with unnamed strategic international investors and leading Taiwanese semiconductor partners, alongside structured technology transfer, engineering partnerships and local talent development, in line with Malaysia's National Semiconductor Strategy and New Industrial Master Plan (NIMP) 2030. The specific Malaysian site/state, investment value, capacity and production timeline have not been disclosed. Key facility details include: The facility is situated at Malaysia (specific site/state not yet disclosed). It focuses on Compound Semiconductor, GaN, SiC on 200mm wafers.