Preferences

Theme
Construction EU Chips ActGerman Government

ESMC Dresden

ESMC · Wilschdorfer Landstraße, 01109 Dresden, Germany
💰
$10.9B
Investment
💿
40,000
Wafers / Month
📅
2027
Production Start
🔵
300mm
Wafer Size

Overview

ESMC (European Semiconductor Manufacturing Company) Dresden is a joint venture of TSMC (70%), Bosch, Infineon, and NXP (10% each), building the EU's first FinFET-capable pure-play foundry fab. The EUR 10 billion project, backed by the EU and the German government under the European Chips Act, broke ground on 20 August 2024 and is planned to produce 40,000 300mm wafers per month on TSMC's 28/22nm planar CMOS and 16/12nm FinFET processes, with production expected to begin by late 2027 and around 2,000 direct jobs. Key facility details include: The facility is situated at Wilschdorfer Landstraße, 01109 Dresden, Germany. It focuses on Automotive / Specialty, Logic / Foundry and 12, 16, 22, 28 process nodes on 300mm wafers. This site represents an estimated investment of $10.9B and a production capacity of 40,000 wafers per month. Production at this facility is expected to begin in 2027.

ESMC

About ESMC

ESMC is a joint venture in Dresden, Germany, established by TSMC, Bosch, Infineon, and NXP. Operated by TSMC, the facility focuses on advanced 28/22nm and 16/12nm technologies to support the automotive and industrial sectors in Europe.

🗺️ View ESMC Dresden on the Interactive Map
🛡️

Privacy & Choice

We use essential functional storage for your site preferences. Would you also allow us to use additional tracking for platform intelligence?