HCL-Foxconn (India Chip) Jewar OSAT

Overview

An outsourced semiconductor assembly & test (OSAT / Modified ATMP) plant being built by India Chip Pvt Ltd, a joint venture of India's HCL Group and Taiwan's Hon Hai Technology Group (Foxconn), at Jewar in Greater Noida within the Yamuna Expressway Industrial Development Authority (YEIDA), Uttar Pradesh. It is the sixth unit approved under the India Semiconductor Mission and Uttar Pradesh's first semiconductor facility. Prime Minister Narendra Modi virtually laid the foundation stone on 21 February 2026. The plant will package display driver chips (DDICs) for mobile phones, laptops, automobiles, PCs and other display devices, with an installed capacity of about 20,000 wafers per month, equivalent to roughly 36 million display driver chips per month. Total investment is over INR 3,700 crore (~US$0.44 billion); volume production is targeted for 2028. Key facility details include: The facility is situated at Yamuna Expressway Industrial Development Authority (YEIDA), Jewar, Greater Noida, Uttar Pradesh, India. It focuses on Assembly & Packaging. This site represents an estimated investment of $0.44B and a production capacity of 20,000 wafers per month. Production at this facility is expected to begin in 2028.