Nepes Corporation - Cheongju / Ochang

Overview

Nepes Corporation (KOSDAQ 033640) is a South Korean outsourced semiconductor packaging and test company, founded in 1990, and one of the small number of OSATs with high-volume fan-out wafer-level-packaging (FOWLP) capability. Operating from plants in Cheongju and Ochang (Chungcheongbuk-do), Nepes provides flip-chip bumping, wafer-level packaging (WLP), fan-out wafer-level and fan-out panel-level packaging (FOPLP, on 600x600mm panels), system-in-package (SiP), 2.5D/3D advanced packaging and back-end test, positioning itself as a comprehensive back-end foundry for system semiconductors. As a wafer-level-packaging and bumping house it processes 200mm and 300mm wafers, with an official company-wide processing capacity of about 1,104,000 wafers per year (roughly 92,000 wafers per month) across its Cheongju and Ochang campuses and 2024 sales of about KRW 460 billion; that figure is a two-campus aggregate rather than a single-facility number, so it is not recorded in the per-facility capacity field. It carries no wafer-fab process node, and plant cost is not disclosed. Key facility details include: The facility is situated at Ochang / Cheongju, Chungcheongbuk-do, South Korea (Nepes Cheongju and Ochang plants). It focuses on Advanced Packaging, Assembly & Packaging on 200mm, 300mm wafers. Production at this facility commenced in 1990.