Overview
Nuvoton Technology operates a 6-inch wafer fab in Hsinchu Science Park, the former Winbond Fab 2, with a capacity of 45,000 wafers per month on 0.35um to 1.0um processes (generic logic, mixed-signal, high voltage, ultra-high voltage, power management, mask ROM, and embedded logic NVM). Alongside its own logic, consumer, and computer IC lines, the fab provides foundry services to external customers. Key facility details include: The facility is situated at Hsinchu Science Park, Hsinchu, Taiwan. It focuses on Logic / Foundry and 350, 1000 process nodes on 150mm wafers. This site represents a production capacity of 45,000 wafers per month. Production at this facility commenced in 2008.
Technology
About Nuvoton Technology
Nuvoton Technology, spun off from Winbond Electronics' Logic IC business in 2008, is a fab-lite Taiwanese semiconductor company providing microcontrollers, ICs, and wafer foundry services from its Hsinchu Science Park facility.