Tong Hsing Electronic Industries Taoyuan Plant - Main Plant

Overview

Tong Hsing Electronic Industries was established in 1974 in Yingge, New Taipei City, and branched out into microelectronic element (semiconductor) packaging in 1979, later adding wireless communication component packaging in 1996 and a Philippine assembly subsidiary in 1994; it listed on the Taiwan Stock Exchange in 2007. The company is a world-leading manufacturer of direct-plated-copper (DPC) and direct-bonded-copper ceramic metalized substrates and an OSAT provider of customized semiconductor micro-module packaging and test, including power amplifier modules, hybrid integrated circuits, and CMOS imaging services such as wafer probing, back-grinding, assembly, and inspection, serving wireless communications, MEMS, image sensor, LED, automotive, and medical-device customers from its current headquarters and plant in Bade District, Taoyuan. As an outsourced assembly/substrate house rather than a wafer fab, it has no process node or wafer-size of its own and does not disclose per-site capacity or investment figures. Key facility details include: The facility is situated at No. 88, Lane 1125, Heping Rd., Bade Dist., Taoyuan City 334, Taiwan. It focuses on Assembly & Packaging, Sensors. Production at this facility commenced in 1979.