Overview
Unisem (M) Berhad is a Malaysian outsourced semiconductor assembly and test (OSAT) group, incorporated in 1989 and providing back-end services to electronics companies across Asia, Europe and the United States. Its services cover wafer bumping, wafer probing and grinding, a broad range of leadframe and substrate IC packaging, wafer-level chip-scale packaging (WLCSP) and RF, plus analog, digital and mixed-signal test. The group operates its main plant in Ipoh, Perak, Malaysia, alongside factories in Chengdu, China and Batam, Indonesia, and employs about 7,000 people worldwide (group offices are in Kuala Lumpur). As a back-end assembly and test operation it has no wafer-fab process node; per-facility monthly wafer capacity is not a fab metric and plant cost is not disclosed. Key facility details include: The facility is situated at Ipoh, Perak, Malaysia (main Unisem plant; group offices in Kuala Lumpur). It focuses on Advanced Packaging, Assembly & Packaging. Production at this facility commenced in 1989.