Overview
A wafer fabrication plant being built by the military-run Viettel Group at Hoa Lac Hi-Tech Park in Hanoi -- Vietnam's first large-scale domestic semiconductor fabrication facility, previously the country had only chip design, packaging and test. Viettel broke ground on 16 January 2026 on the roughly 27-hectare site with an initial investment of about US$1.3 billion. The fab is to manufacture 32-nanometre chips for aerospace, telecommunications, Internet-of-Things, automotive, medical-device and industrial-automation applications. Viettel targets completing construction, receiving technology transfer and beginning pilot production by the end of 2027, then optimising its production processes to international standards between 2028 and 2030. The project supports Vietnam's national strategy to build a domestic semiconductor industry and train 50,000 chip-design engineers by 2030. Key facility details include: The facility is situated at Hoa Lac Hi-Tech Park, Hanoi, Vietnam. It focuses on Logic / Foundry and 32 process nodes. This site represents an estimated investment of $1.3B. Production at this facility is expected to begin in 2027.