Overview
Xintec Inc. was founded in 1998 in the Zhongli (JhongLi) Industrial Park, Taoyuan, Taiwan, and was the first packaging house to commercialize wafer-level chip-scale packaging (WLCSP). It provides wafer-level CSP, post-passivation interconnect (PPI) and related back-end services mainly for CMOS image sensors, plus optical, biometric and MEMS/sensor packaging for camera, communications, computing, industrial and automotive customers. TSMC acquired a majority (about 51%) stake in January 2007 to support its CMOS image-sensor business; following Xintec's March 2015 IPO on the Taipei Exchange, TSMC's stake diluted to roughly 41%, which it still holds. As a packaging/back-end operation it has no wafer-fab process node; wafer size, per-facility capacity and plant cost are not disclosed. Key facility details include: The facility is situated at Zhongli (JhongLi) Industrial Park, Taoyuan, Taiwan. It focuses on Assembly & Packaging, Advanced Packaging. Production at this facility commenced in 1998.