Overview
The B4 West Annex expansion at Broadcom's Fort Collins site, expanding their 200mm specialty RF device manufacturing capabilities. The Fort Collins campus itself traces to Hewlett-Packard's 1978 expansion into the site, but this specific building's own construction/production-start date is not separately documented; the campus it passed to Agilent Technologies (HP's 1999 spinoff), then to Avago Technologies (formed from Agilent's semiconductor products group), which acquired Broadcom in 2015 and took its name. Today the 1.4 million sq ft campus (185,000 sq ft of cleanroom) is Broadcom's largest owned wafer fab site, specializing in RF filter technology for smartphones, including a 2023 agreement to manufacture 5G RF components for Apple. Key facility details include: The facility is situated at Fort Collins, Colorado, USA. It focuses on Automotive / Specialty, RF / Wireless on 200mm wafers.
Broadcom Fort Collins Campus
Broadcom's primary RF and specialty semiconductor campus in Colorado.
Facility Phases
Technology
About Broadcom
Broadcom Inc. is a major US semiconductor and infrastructure-software company (NASDAQ: AVGO). While primarily fabless for its core IC business, Broadcom operates a wafer fabrication facility in Fort Collins, Colorado (legacy Agilent/HP heritage, FBAR RF filter production), and announced a EUR930 million investment to build a new wafer fab in Spain.