Overview
CanSemi (Guangzhou CanSemi Technology, also known as Yuexin) operates the first 12-inch (300mm) wafer fab in South China's Guangdong Province. Built from March 2018 with a total investment of about 28.8 billion yuan (roughly US$4 billion), the Huangpu District fab began mass production in September 2019, initially making 0.18-micron to 90nm analog ICs and discrete devices. Later phases added 65-40nm high-voltage BCD processes, taking combined capacity toward 80,000 wafers per month for automotive, industrial and IoT customers in the Greater Bay Area. Key facility details include: The facility is situated at Huangpu District, Guangzhou, Guangdong, China. It focuses on Logic / Foundry, Analog / Power and 40, 55, 90, 180 process nodes on 300mm wafers. This site represents an estimated investment of $4B and a production capacity of 80,000 wafers per month. Production at this facility commenced in 2019.