Companies operating here
ASE GroupAscenPowerAucksunBYD SemiconductorCR MicroCXMTCanSemiGTA SemiconductorGalaxyCoreHangzhou HFC SemiconductorHua Hong SemiconductorHua Li MicroelectronicsInfineon TechnologiesIntelJCETJiangsu Advanced Memory SemiconductorJilin Sino-MicroelectronicsMicron TechnologyNanjing Guosheng Electronic Co.NexchipNexchip SemiconductorSITRISK HynixSMICSTMicroelectronicsSamsungSan'an OptoelectronicsSanan OptoelectronicsShanghai IC R&D Center (ICRD)Silan MicroelectronicsSoitec / SimguiSwaySure TechnologyTSMCTexas InstrumentsTongfu MicroelectronicsUMCWingtech / NexperiaXMCYMTC
China hosts 77 semiconductor fabs operated by 39 companies, with $180B in capital investment and 3,764,600 wafers/month of combined capacity. 9 facilities are under construction and 3 more are planned. The mix spans 4 leading-edge (sub-7nm) and 13 mature-node plants. Key operators include ASE Group, AscenPower, Aucksun, and others.
Directory
77 Facilities- ASE SuzhouActive
- AscenPower SiC LineActive
- Aucksun OptoelectronicsActive
- BYD Semiconductor Changsha FabActive
- BYD Semiconductor Jinan FabActive
- BYD Semiconductor Ningbo FabActive
- Chengdu BYD Semiconductor FabActive
- CR Micro Chongqing 12-inchActive
- CR Micro Wuxi 8-inch & 12-inchActive
- CXMT Beijing (Fab C)Active
- CXMT Hefei (Fab A)Active
- CanSemi Guangzhou FabActive
- GTA Lingang FabActive
- GTA Semiconductor Lin-gangActive
- GalaxyCore Lin-gang 12-inch CIS FabActive
- Hangzhou HFC Semiconductor FabOn Hold
- HHGrace Shanghai Fab 1Active
- Hua Hong Fab 7Active
- Hua Hong Wuxi II (Fab 9)Construction
- HLMC Fab 5 (Zhangjiang)Active
- Infineon WuxiActive
- Intel ChengduActive
- Intel ShanghaiActive
- JCET Advanced Packaging (Jiangyin)Active
- JCET ChuzhouActive
- JCET JiangyinActive
- JCET Lingang Advanced Packaging CenterPlanned
- JCET MicroelectronicsActive
- JCET STATS ChipPAC China (Jiangyin)Active
- JCET Shanghai AutomotiveActive
- JCET SuqianActive
- SanDisk Semiconductor ShanghaiActive
- Jiangsu Advanced Memory Semiconductor HuaianCancelled
- Jilin Sino-Microelectronics Jilin CityActive
- Micron Xi'anActive
- Nanjing Guosheng Epitaxial Wafer FabActive
- Nexchip HefeiActive
- Nexchip Hefei Fab 1Active
- SITRI 8-inch More-than-Moore Pilot LineActive
- SK Hynix C2Active
- SK Hynix Fab 68 (Dalian)Active
- SMIC Beijing (Fab 2)Active
- SMIC Beijing (Phase 2)Active
- SMIC Jingcheng (Beijing Mega Fab)Construction
- SMIC Orient (Shanghai Mega Fab)Construction
- SMIC SN1 (Shanghai South)Active
- SMIC SN2 (Shanghai South)Construction
- SMIC Shanghai (Fab 1)Active
- SMIC Shanghai (Fab 8)Active
- SMIC Shenzhen (Fab 15)Active
- SMIC Shenzhen (Fab 16)Active
- SMIC Tianjin (Fab 3)Active
- SMIC Xicheng (Tianjin Mega Fab)Construction
- SMIC Xincheng (Shenzhen Mega Fab)Construction
- ST Shenzhen Assembly & TestActive
- Samsung Suzhou (Test & Packaging)Active
- Samsung Xi'an X1Active
- Samsung Xi'an X2Active
- San'an Optoelectronics Xiamen BaseActive
- Sanan IC SiC/GaN Power Fab (Fuzhou)Active
- Sanan IC XiamenActive
- Shanghai IC R&D Center (ICRD)Active
- Silan Micro Xiamen 12-inchActive
- Soitec / Simgui ShanghaiActive
- SwaySure Technology Shenzhen FabConstruction
- TSMC China Company Limited Fab 10Active
- TSMC Nanjing Company Limited Fab 16Active
- Texas Instruments CFAB (Chengdu)Active
- Tongfu Microelectronics HefeiActive
- UMC Fab 12X (United Semi Xiamen)Active
- UMC Fab 8N (Hejian)Active
- Nexperia Lingang 12-inch FabConstruction
- XMC Fab 1 & 2 (Wuhan Xinxin)Active
- YMTC Wuhan (Phase 1 & 2)Active
- YMTC Wuhan (Phase 3)Construction
- YMTC Wuhan (Phase 4)Planned
- YMTC Wuhan (Phase 5)Planned