Overview
The Lingang 12-inch fab in Shanghai's Lingang Free Trade Zone is a roughly RMB 12B (~$1.8B) automotive-grade power semiconductor wafer fab built by Wingtech Technology (Nexperia's Chinese parent) starting in July 2021, operated through the Wingtech-affiliated Shanghai Dingtai Jiangxin / Wingsky Semi. The original 2022 production target slipped by years. After the October 2025 split between Nexperia's Dutch parent and its Chinese unit cut off European wafer supply, the fab was pressed into service for Nexperia China: small-batch production of 12-inch bipolar discrete devices on an independently developed platform was reported in March 2026, and automotive IGBT wafer qualification is under way, as Nexperia China moves toward fully local production. Key facility details include: The facility is situated at Lingang New Area, Shanghai, China. It focuses on Analog / Power, Automotive / Specialty on 300mm wafers. This site represents an estimated investment of $1.8B and a production capacity of 40,000 wafers per month. Production at this facility commenced in 2026.