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SiEn (Qingdao) Integrated Circuits - Phase 1

SiEn (Qingdao) Β· Qingdao West Coast New Area (Huangdao), Qingdao, Shandong, China
πŸ’°
$1.2B
Investment
πŸ’Ώ
N/A
Wafers / Month
πŸ“…
2021
Production Start
πŸ”΅
200mm, 300mm
Wafer Size

Overview

SiEn (Qingdao) Integrated Circuits' wafer fab in the Qingdao West Coast New Area (Huangdao), Shandong, China. SiEn was founded/launched in 2018 by Richard Chang (Zhang Rujing), the founder of SMIC, as China's first CIDM (Collaborative IDM) project -- a model that pools IC-design companies, end-application companies and the manufacturer as joint investors (about 50 design partners participate), developing processes for selected customers ahead of plant completion. The Qingdao State-owned Assets Supervision & Administration Commission is the largest shareholder with a 67% stake. The fab runs an 8-inch high-power and digital-analog hybrid line (production began in early August 2021, with reported yields above 90%) and a 12-inch line for 40nm-to-28nm ultra-low-power logic, embedded and RF-SOI products (production began in mid-August 2021); it also operates a 180nm-to-14nm photomask line. Total project investment is about RMB 21.8 billion (~US$3.3 billion), of which the first phase that built the two operating lines was about RMB 8.1 billion (~US$1.2 billion). Key facility details include: The facility is situated at Qingdao West Coast New Area (Huangdao), Qingdao, Shandong, China. It focuses on Logic / Foundry, Analog / Power, RF / Wireless and 28, 40 process nodes on 200mm, 300mm wafers. This site represents an estimated investment of $1.2B. Production at this facility commenced in 2021.

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