Hangzhou HFC Semiconductor

Overview

Hangzhou HFC Semiconductor Corp. (Hangzhou Houde Semiconductor) is a Chinese fabless-to-IDM company building a 12-inch (300mm) wafer fab in the Qiantang District of Hangzhou, Zhejiang. Focuses on mixed-signal and RF semiconductor manufacturing platform. Added to the US Entity List in October 2022; American employees subsequently resigned. Construction activity continued into 2024 (PDMS monitoring systems put into operation May 2024) but the fab had not reached production as of mid-2025. The project (Chinese name: Hangzhou Jihai Semiconductor, founded September 2019) was planned at a total investment of RMB 35 billion (~US$4.9 billion), phased from an initial 4,000 wafers/month up to a phase-1 capacity of 20,000 wafers/month, with a phase 2 adding another 40,000 wafers/month. Key facility details include: The facility is situated at 599 Dongwei Street, Qiantang District, Hangzhou, Zhejiang, China. It focuses on Logic / Foundry, Analog / Power on 300mm wafers. This site represents an estimated investment of $4.9B and a production capacity of 20,000 wafers per month.