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Huatian Technology - Xi'an

Tianshui Huatian Technology · Xi'an Economic & Technological Development Zone, Xi'an, Shaanxi, China

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Investment

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Wafers / Month

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2008

Production Start

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Wafer Size

Overview

Huatian Technology (Xi'an) Co., Ltd. is the Xi'an integrated-circuit packaging and test subsidiary of Tianshui Huatian Technology (SZSE 002185), one of China's largest OSATs. It was established in January 2008 in the Xi'an Economic & Technological Development Zone, Shaanxi, with a registered capital of about RMB 1.54 billion, and provides QFN, BGA and Flip-Chip IC packaging and test services. As an OSAT it has no wafer-fab process node, and per-facility monthly wafer capacity and plant cost are not disclosed. Key facility details include: The facility is situated at Xi'an Economic & Technological Development Zone, Xi'an, Shaanxi, China. It focuses on Assembly & Packaging. Production at this facility commenced in 2008.

Facility Complex