Huatian Technology - Tianshui (Main)
Overview
Tianshui Huatian Technology Co., Ltd. (SZSE 002185) is one of the largest outsourced semiconductor assembly and test (OSAT) companies in mainland China, ranked roughly third in China and among the world's top six or seven by revenue (about US$2.0 billion in 2024). Its main base is in Tianshui, Gansu province. The listed company, known as HT-Tech, was formed on 25 December 2003 and held its IPO on the Shenzhen Stock Exchange on 20 November 2007. The lineage traces back to the state-owned Yonghong Appliance Factory (Factory 749), established in 1969 to produce integrated circuits and relocated to Tianshui in 1994. The company specialises in advanced packaging including system-in-package (SiP), through-silicon via (TSV), fan-out and wafer-level packaging (WLP), and operates production bases in Tianshui, Xi'an, Kunshan and Nanjing, plus overseas subsidiaries (FlipChip in Phoenix, Arizona, and Unisem in Malaysia). As an OSAT it has no wafer-fab process node, and per-facility monthly wafer capacity and plant cost are not disclosed. Key facility details include: The facility is situated at Shuangqiao North Road, Qinzhou District, Tianshui, Gansu, China. It focuses on Assembly & Packaging, Advanced Packaging. Production at this facility commenced in 2003.
Huatian Technology
Tianshui Huatian Technology (SZSE 002185), China's third-largest OSAT; main base in Tianshui with plants in Xi'an, Kunshan and Nanjing.