Tongfu Microelectronics Fabs

Tongfu Microelectronics Co., Ltd. (通富微电子, stock code: 002156 on Shenzhen Exchange) is one of China's largest OSATs, founded in 1997 and headquartered in Nantong, Jiangsu. Offers IC packaging and test including flip-chip BGA, SiP, memory packaging (HBM, LPDDR), wafer-level packaging, and automotive IC assembly. Strategic packaging partner for AMD. Seven production bases in Nantong (HQ), Hefei, Xiamen, Suzhou, and Penang (Malaysia). Revenue: ~US$3.73B trailing 12-month (as of 2025); 18,000+ employees.