Overview
Tongfu Microelectronics (通富微电) is one of China's largest OSATs, publicly listed on the Shenzhen Stock Exchange. The Hefei base is one of its seven production facilities. Specializes in IC assembly and test including flip-chip, BGA, SiP, and memory packaging. Raised RMB 4.4B in 2026 for capacity expansion across memory, automotive, and wafer-level packaging. Key facility details include: The facility is situated at Hefei, Anhui, China. It focuses on Assembly & Packaging.
Technology
About Tongfu Microelectronics
Tongfu Microelectronics Co., Ltd. (通富微电子, stock code: 002156 on Shenzhen Exchange) is one of China's largest OSATs, founded in 1997 and headquartered in Nantong, Jiangsu. Offers IC packaging and test including flip-chip BGA, SiP, memory packaging (HBM, LPDDR), wafer-level packaging, and automotive IC assembly. Strategic packaging partner for AMD. Seven production bases in Nantong (HQ), Hefei, Xiamen, Suzhou, and Penang (Malaysia). Revenue: ~US$3.73B trailing 12-month (as of 2025); 18,000+ employees.