Tongfu Microelectronics - Nantong

Overview

The Nantong campus is Tongfu Microelectronics' headquarters and flagship back-end site, at No. 288 Chongchuan Road in Nantong, Jiangsu. Tongfu Microelectronics (SZSE: 002156) is one of the largest outsourced semiconductor assembly and test (OSAT) companies in mainland China. The business was founded in June 1997 as Nantong Fujitsu Microelectronics (tracing back to the state-owned Nantong Transistor Factory established in 1966, and to Nantong Huada Microelectronics from 1990), listed on the Shenzhen Stock Exchange in 2007, and adopted its current name in December 2016. It operates production bases in Nantong, Hefei, Xiamen and Suzhou in China and in Penang, Malaysia (its Suzhou and Penang operations came from AMD in 2015), and focuses on advanced packaging for high-performance computing, automotive, memory and new-energy applications, including high-bandwidth memory (HBM) packaging. As a back-end assembly and test operation it has no wafer-fab process node; per-facility monthly wafer capacity is not disclosed and plant cost is not a fab metric here. Key facility details include: The facility is situated at No. 288 Chongchuan Road, Nantong, Jiangsu, China. It focuses on Assembly & Packaging. Production at this facility commenced in 1997.