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Jiangsu Advanced Memory Semiconductor

Jiangsu Advanced Memory Semiconductor Β· Huaian, Jiangsu Province, China
πŸ’°
$1.78B
Investment
πŸ’Ώ
N/A
Wafers / Month
πŸ“…
2019
Production Start
πŸ”΅
300mm
Wafer Size

Overview

Jiangsu Advanced Memory Semiconductor Co., Ltd. (JSAMSC) was a Chinese phase-change memory (PCM) IDM established in October 2016 in Huaian, Jiangsu Province. Aimed to develop China's first 3D XPoint-class PCM technology on a 12-inch (300mm) wafer fab with planned annual capacity of 100,000 wafers and initial investment of RMB 13 billion (~$1.78B). Developed first-generation PCM chips by 2019 but ran out of funding by 2020. Formal bankruptcy and liquidation proceedings accepted by the Huaian court in July 2023. A rescue plan by Huaxin Jiechuang, approved in 2024, collapsed in 2025 due to unmet funding commitments, finalizing closure. Key facility details include: The facility is situated at Huaian, Jiangsu Province, China. It focuses on Memory on 300mm wafers. This site represents an estimated investment of $1.78B. Production had been targeted for 2019 before the project was cancelled.

Technology

Jiangsu Advanced Memory Semiconductor

About Jiangsu Advanced Memory Semiconductor

Jiangsu Advanced Memory Semiconductor Co., Ltd. (JSAMSC) was a Chinese phase-change memory (PCM) manufacturer established in October 2016 in Huaian, Jiangsu Province. It aimed to develop 3D XPoint-class PCM technology on a 12-inch (300mm) fab with planned capacity of 100,000 wafers/year (investment: RMB 13 billion / ~$1.78B). First-generation PCM chips were developed by 2019, but funding collapsed by 2020. Formal bankruptcy and liquidation was accepted by Huaian court in July 2023; a final rescue attempt by Huaxin Jiechuang collapsed in 2025.

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