Overview
A new $1.15 billion advanced chip packaging and testing facility planned for Shanghai's Lingang Special Area. JCET is investing through a controlled subsidiary (registered capital ~$560M) to expand high-end packaging capabilities including 2.5D packaging with surface roughness targets below 0.2nm. Positioned as a response to US export restrictions limiting Chinese chipmakers' access to TSMC. First phase completion targeted for H2 2028; two-phase development overall. Key facility details include: The facility is situated at Lingang Special Area, Shanghai, China. It focuses on Advanced Packaging. This site represents an estimated investment of $1.15B. Production at this facility is expected to begin in 2028.
JCET Group
Assembly & Packaging
* This is a sum of all 11 facility phases (current & planned).
Facility Phases
Technology
About JCET
JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services including design, and advanced packaging.