Overview
JCET Automotive Electronics (Shanghai) is JCET's automotive-grade chip packaging and testing flagship factory in the Lingang Special Area, Shanghai. Backed by a RMB 4.4 billion (~$600 million) capital increase announced in November 2023, the plant covers intelligent cockpit, intelligent connectivity, and safety sensor chips with traditional, advanced module, and system-level packaging. The production line reached readiness at the end of 2025 and the plant officially launched production in March 2026. Key facility details include: The facility is situated at No. 3588 Jiangshan Road, Lingang New Area, Shanghai, China. It focuses on Assembly & Packaging. This site represents an estimated investment of $0.6B. Production at this facility commenced in 2026.
JCET Group
Assembly & Packaging
* This is a sum of all 11 facility phases (current & planned).
Facility Phases
Technology
About JCET
JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services including design, and advanced packaging.