N/A
Investment
N/A
Wafers / Month
2003
Production Start
N/A
Wafer Size
Overview
JCET Advanced Packaging Co. (JCAP) was established in 2003 as a subsidiary of newly-listed JCET, and grew into China's largest wafer-level packaging (WLP) business. Key facility details include: The facility is situated at 78 Changshan Road, Jiangyin, Jiangsu, China. It focuses on Assembly & Packaging. Production at this facility commenced in 2003.
Facility Complex
JCET Group
Assembly & Packaging
$1.75B
Projected Investment
TBA
Projected WPM Capacity
* This is a sum of all 11 facility phases (current & planned).
Facility Phases
Technology
About JCET
JCET Group is a leading global semiconductor system integration packaging and test provider, offering a full range of turnkey services including design, and advanced packaging.
Data Quality: 48%