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CXMT Beijing (Fab C) - C1/C2

CXMT Β· Economic-Technological Development Area (BDA), Beijing, China
πŸ’°
N/A
Investment
πŸ’Ώ
100,000
Wafers / Month
πŸ“…
2022
Production Start
πŸ”΅
300mm
Wafer Size

Overview

CXMT Beijing (Fab C) is an active semiconductor manufacturing facility operated by CXMT in China. Key facility details include: The facility is situated at Economic-Technological Development Area (BDA), Beijing, China. It focuses on Memory, DRAM and 19, 17 process nodes on 300mm wafers. This site represents a production capacity of 100,000 wafers per month. Production at this facility commenced in 2022.

Technology

MemoryDRAM 1917
CXMT

About CXMT

ChangXin Memory Technologies (CXMT) is a leading Chinese semiconductor company specializing in the design and manufacturing of dynamic random-access memory (DRAM). CXMT is a key driver of memory innovation in Asia, producing advanced DDR4, LPDDR4, and DDR5 products.

πŸ—ΊοΈ View CXMT Beijing (Fab C) - C1/C2 on the Interactive Map
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