Overview
CXMT Beijing (Fab C) in the Beijing Economic-Technological Development Area is ChangXin Memory Technologies' second major 300mm DRAM fab. The Beijing project started around 2020, reached a pilot-line milestone in early 2022, and expands CXMT's DDR4/LPDDR4 and advanced DRAM output on 17–19nm-class processes. Key facility details include: The facility is situated at Economic-Technological Development Area (BDA), Beijing, China. It focuses on Memory, DRAM and 19, 17 process nodes on 300mm wafers. This site represents a production capacity of 100,000 wafers per month. Production at this facility commenced in 2022.
About CXMT
ChangXin Memory Technologies (CXMT) is a leading Chinese semiconductor company specializing in the design and manufacturing of dynamic random-access memory (DRAM). CXMT is a key driver of memory innovation in Asia, producing advanced DDR4, LPDDR4, and DDR5 products.