Nexchip Hefei Campus - N1A1/N1A2/N1A3

Overview

Nexchip Semiconductor (合肥晶合) is a 12-inch foundry JV between Hefei City Construction Investment and Powerchip (Taiwan), founded 2015. First 12-inch fab in Anhui Province. Operates N1A1/N1A2 phases; N1A3 (Phase IV, CNY 35.5B / ~US$5.1B) under construction to add 40nm/28nm capacity of ~55,000 wpm by 2028. Products: DDIC, CIS, MCU, PMIC, Logic on 40/55/90/110/150nm, with a 22nm process in development. Capacity exceeded 100,000 wpm in 2022 and reached about 139,000 wpm (~1.67 million 300mm-equivalent wafers annually) by 2025, the year of the company's Hong Kong listing. Key facility details include: The facility is situated at No. 88 Xifeihe Rd., Hefei Comprehensive Bonded Zone, Xinzhan District, Hefei, Anhui, China. It focuses on Logic / Foundry, Sensors and 40, 55, 90, 110, 150 process nodes on 300mm wafers. This site represents a production capacity of 139,000 wafers per month. Production at this facility commenced in 2019.