Overview
YMTC's flagship 3D NAND flash campus (Fab 1 and Fab 2) in Wuhan's East Lake High-tech Development Zone is the company's main memory production base. Built on YMTC's proprietary Xtacking bonding architecture, it reached high-volume production of 232-layer 3D TLC NAND (the X3-9070, YMTC's fourth generation, Xtacking 3.0) and has since begun ramping its fifth-generation (294-layer, Xtacking 4.0) products. Key facility details include: The facility is situated at East Lake High-tech Development Zone, Wuhan, China. It focuses on NAND and 232-layer 3D TLC NAND (Xtacking 3.0) process nodes on 300mm wafers. This site represents an estimated investment of $24B and a production capacity of 200,000 wafers per month. Production at this facility commenced in 2020.
YMTC Wuhan ()
* This is a sum of all 4 facility phases (current & planned).
Facility Phases
Technology
About YMTC
Yangtze Memory Technologies Co., Ltd. (YMTC) is an IDM semiconductor company focusing on 3D NAND flash memory design and manufacturing. YMTC's Xtacking architecture drives innovation in storage performance and density.