YMTC Wuhan () - Phase 3

Overview

YMTC Wuhan Phase 3 is a 300mm 3D NAND flash fab at the company's site in the East Lake High-tech Development Zone of Wuhan, China. It is run through a joint venture formally established in September 2025 with registered capital of RMB 20.72 billion (nearly US$3 billion), held 50.2% by YMTC and 49.8% by the state-backed Hubei Changsheng Phase III fund. Building on YMTC's wafer-bonding Xtacking architecture, the fab is being brought up on the company's latest Xtacking 4.0-generation (around 270-layer) 3D NAND and is expected to begin mass production in 2026, expanding YMTC's output beyond the existing Phase 1 and Phase 2 fabs toward a targeted capacity of about 100,000 wafers per month. Key facility details include: The facility is situated at East Lake High-tech Development Zone, Wuhan, China. It focuses on NAND, DRAM and 3D NAND (Xtacking 4.0) process nodes on 300mm wafers. This site represents a production capacity of 100,000 wafers per month. Production at this facility is expected to begin in 2026.