SK Hynix China

Overview

SK hynix Semiconductor (Chongqing) Ltd. is the company's large-scale back-end packaging and test base in the Xiyong Comprehensive Bonded Zone, Shapingba District, Chongqing. The entity was established in 2013 and began operations in 2014, and it performs assembly, packaging and final test rather than wafer fabrication, handling the downstream stage for much of SK Hynix's NAND flash output (reports also cite DRAM packaging and test). In August 2026 Bloomberg reported that SK Hynix was weighing a stake sale in the plant at a valuation of roughly $3 billion, with Chinese investment funds and domestic chipmakers as possible buyers and SK Hynix potentially retaining a minority holding. Responding to a Korea Exchange inquiry on 10 August 2026, the company said it is "reviewing various options for the Chongqing plant to strengthen its competitiveness" but that nothing has been decided, promising a further disclosure within one month. The review is read as part of a shift of capital toward higher-margin AI memory and domestic capacity, announced alongside a 54.3 trillion won (about $38 billion) expansion of the Yongin DRAM and Cheongju NAND sites in South Korea; back-end operations are more readily opened to outside partners than front-end fabs because they do not carry the most advanced process technology. The plant remains in operation. Key facility details include: The facility is situated at Xiyong Comprehensive Bonded Zone, B Block V2-4/02, Shapingba District, Chongqing 400030, China. It focuses on Assembly & Packaging, NAND, DRAM. Production at this facility commenced in 2014.