Overview
An advanced packaging and test facility (P&T7) under construction in Cheongju, North Chungcheong Province. SK Hynix will invest 20 trillion won (~$12.9 billion) to strengthen chip packaging capabilities to support growing demand for NAND products. Per SK Hynix's F-1 SEC registration statement (filed 2026-07-06), construction is underway with completion expected by the end of 2027. Part of SK Hynix's 100 trillion won commitment to the Chungcheong region under South Korea's 'Three Mega Projects' initiative announced June 2026. Key facility details include: The facility is situated at Cheongju, Chungcheongbuk-do, South Korea. It focuses on Advanced Packaging on 300mm wafers. This site represents an estimated investment of $12.9B. Production at this facility is expected to begin in 2027.
SK Hynix Cheongju Campus
SK Hynix's primary NAND flash production campus in Cheongju, North Chungcheong Province; existing fabs include M11, M12, M15, and M15X.
* This is a sum of all 2 facility phases (current & planned).
Facility Phases
Technology
About SK Hynix
SK Hynix is a leading global semiconductor company specializing in memory and storage products. As a top-tier provider of DRAM and NAND flash, SK Hynix is a principal supplier of High Bandwidth Memory (HBM) for AI and data centers.