United Nova Technology (UNT) Shaoxing - Phase 4

Overview

United Nova Technology's Phase IV project: a 12-inch (300mm) automotive-grade mixed-signal wafer fab at its Shaoxing campus, announced on 11 June 2026 through a capital-increase cooperation with the committee of the Shaoxing section of the Hangzhou-Shaoxing Airport Economic Integration Demonstration Zone. Once complete it is planned to provide a monthly capacity of 50,000 300mm wafers, for a total project investment of about 20 billion yuan (~US$2.8 billion), with registered capital of 12 billion yuan of which UNT contributes 3.012 billion yuan from its own funds. The product roadmap spans MCU and DSP at 40-28nm, analog BCD and DrMOS at 90-55nm, and 55nm silicon-photonics chips and laser-driver ICs aimed at optical-interconnect demand in AI infrastructure. Key facility details include: The facility is situated at Yuecheng District, Shaoxing, Zhejiang, China. It focuses on Logic / Foundry, Analog / Power, Mixed-Signal, Photonics / Optical and 28, 40, 55, 90 process nodes on 300mm wafers. This site represents an estimated investment of $2.8B and a production capacity of 50,000 wafers per month.