Overview
BYD Semiconductor Ningbo is a 6-inch (150mm) wafer fab originally built by TSMC as their first China fab and later acquired by BYD via Ningbo SinoMOS Semiconductor in 2008. It produces IGBTs, power MOSFETs, and diodes supporting BYD's EV drivetrain requirements. Key facility details include: The facility is situated at Ningbo, Zhejiang, China. It focuses on Analog / Power on 150mm wafers. This site represents a production capacity of 30,000 wafers per month. Production at this facility commenced in 2020.
Technology
About BYD Semiconductor
BYD Semiconductor Co., Ltd. is the semiconductor subsidiary of Chinese EV giant BYD Company, tracing back to BYD's IC design department founded in 2002. Following its 2008 acquisition of Ningbo SinoMos, BYD Semiconductor became a vertically-integrated IDM (design through manufacturing) and is the largest domestic supplier of automotive IGBT modules in China, also producing battery-management chips, MCUs, sensors, and optoelectronics for BYD's vehicles and external customers.