BYD Chengdu Campus
Overview
Chengdu BYD Semiconductor is a wafer fab established on the former Tsinghua Unigroup Chengdu memory-base site (a 12-inch line construction halted in January 2021), focused on automotive-grade IGBTs and SiC power devices. Chengdu BYD Semiconductor Co. acquired the unfinished site assets for about RMB 1.59 billion via the Southwest United Equity Exchange in December 2022, with hiring for the revived plant beginning in 2023. Key facility details include: The facility is situated at No. 168, Zongbaoheng Road, Shuangliu District, Chengdu, Sichuan, China. It focuses on Analog / Power, Automotive / Specialty on 300mm wafers. Production at this facility commenced in 2023.
Technology
About BYD Semiconductor
BYD Semiconductor Co., Ltd. is the semiconductor subsidiary of Chinese EV giant BYD Company, tracing back to BYD's IC design department founded in 2002. Following its 2008 acquisition of Ningbo SinoMos, BYD Semiconductor became a vertically-integrated IDM (design through manufacturing) and is the largest domestic supplier of automotive IGBT modules in China, also producing battery-management chips, MCUs, sensors, and optoelectronics for BYD's vehicles and external customers.