Hua Li Microelectronics Shanghai Campus
Overview
HLMC's Fab 5 in Shanghai's Zhangjiang Hi-Tech Park is a 12-inch wafer fab with 35,000 wafers/month capacity, established January 2010. It runs 55nm to 28nm process technologies including 55nm embedded flash for IoT, automotive, and smart device applications. Key facility details include: The facility is situated at Zhangjiang Hi-Tech Park, Pudong New Area, Shanghai, China. It focuses on Logic / Foundry and 55, 40, 28 process nodes on 300mm wafers. This site represents a production capacity of 35,000 wafers per month. Production at this facility commenced in 2010.
Technology
About Hua Li Microelectronics
Hua Li Microelectronics (HLMC) is a 300mm pure-play wafer foundry based in Shanghai, majority-owned by the Shanghai municipal government with minority stakes from Huahong Group and Grace Semiconductor. It specializes in 55nm-28nm specialty process technologies including RF, embedded flash, and CMOS image sensors.