Overview
A new, highly-automated assembly & test 'smart factory' that NXP Semiconductors is building at its existing back-end site in Petaling Jaya, Selangor, Malaysia. NXP broke ground on 12 August 2026; the expansion adds about 500,000 square feet of production space, bringing the site to roughly 900,000 square feet, and is expected to ramp production in the first quarter of 2028 and more than double the site's output at full capacity. Built around automated material-handling systems and advanced quality-management technology, it increases NXP's internal assembly and test capacity and reinforces the company's hybrid manufacturing strategy for supply-chain resilience. NXP did not disclose the investment value. Key facility details include: The facility is situated at Petaling Jaya, Selangor, Malaysia. It focuses on Assembly & Packaging. Production at this facility is expected to begin in 2028.
Technology
About NXP Semiconductors
NXP Semiconductors N.V. enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets.