Overview
Siliconware Precision Industries (SPIL, an ASE Group subsidiary) broke ground on this new advanced-packaging and test plant in the Yunlin Technology Industrial Park in Douliu City, Yunlin County, on 11-12 August 2026. The roughly NT$100 billion (~US$3.1 billion), 6-hectare facility will introduce Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging to package and test AI/HPC chips. First-phase operations are targeted for 2028, and the site is expected to create about 2,200 jobs at full capacity. It forms a dual-facility advanced-packaging cluster in central Taiwan with SPIL's nearby Huwei plant, which entered commercial production in September 2025. Key facility details include: The facility is situated at Yunlin Technology Industrial Park, Douliu City, Yunlin County, Taiwan. It focuses on Advanced Packaging, Assembly & Packaging on 300mm wafers. This site represents an estimated investment of $3.1B. Production at this facility is expected to begin in 2028.
SPIL (ASE Group)
Siliconware Precision Industries, an ASE Group subsidiary since 2018.
* This is a sum of all 3 facility phases (current & planned).
Facility Phases
Technology
About SPIL
Siliconware Precision Industries Co., Ltd. (SPIL; η½εη²Ύε―ε·₯ζ₯) is a major OSAT and ASE Technology Holding subsidiary since 2018, headquartered in Taichung, Taiwan. Founded in 1984, SPIL offers wire bond, flip-chip, SiP, BGA, wafer bumping, and final test services on 150/200/300mm wafers. Multiple Taichung facilities (Da Fong, Chung Shan, Zhong Ke) plus operations in Shanghai (Zhangjiang, Jinqiao, Shengxia), Suzhou, Wuxi, Kunshan, South Korea (Paju, Cheonan), and other countries. A new high-end packaging plant is under construction at Central Taiwan Science Park.