Zensemi (Guangzhou Zengxin Technology) - Phase 1

Overview

Zensemi's (Guangzhou Zengxin Technology) first 12-inch (300mm) wafer fab in the Zengcheng Economic and Technological Development Zone, Guangzhou, described as China's first domestically-built 12-inch MEMS and specialty-process wafer manufacturing line. First-phase investment of roughly RMB 7 billion (~US$1 billion); construction broke ground and was reported by EE News Europe in December 2022. The line was connected and commercial production launched on 28 June 2024, per Guangzhou municipal government and Chinese business press, with the first-phase 20,000 wafers/month capacity targeted by the end of 2025. Products focus on MEMS sensors (mechanical, acoustic, microfluidic and biological) plus supporting ASIC chips for new-energy vehicles, AI, IoT and industrial-internet applications. Zensemi's longer-term plan (through 2029) calls for a second similarly-sized fab, bringing combined investment to roughly RMB 37 billion and combined capacity to 120,000 wafers/month across both fabs; the second fab had not broken ground as of this entry and is not separately tracked. Key facility details include: The facility is situated at Zengcheng Economic and Technological Development Zone, Guangzhou, Guangdong, China. It focuses on MEMS, Analog / Power on 300mm wafers. This site represents an estimated investment of $1.0B and a production capacity of 20,000 wafers per month. Production at this facility commenced in 2024.