N/A
Investment
N/A
Wafers / Month
2012
Production Start
200mm
Wafer Size
Overview
Denso acquired this plant from Fujitsu Semiconductor, with the ownership transfer (land, building, equipment, and employees) completed October 1, 2012; semiconductor sensor production began June 2017. A subsequent ~US$88 million (10 billion yen) expansion grew floor area from 106,000 sqm to 126,000 sqm and headcount from 616 to about 1,000 by 2020. Key facility details include: The facility is situated at Isawa-gun, Kanegasaki-cho, Iwate, Japan. It focuses on Automotive / Specialty, Automotive / Specialty, MEMS on 200mm wafers. Production at this facility commenced in 2012.
Facility Complex
Denso Semiconductor Division
Denso's internal automotive semiconductor manufacturing facilities.
N/A
Total Investment
N/A
Total WPM Capacity
Facility Phases
Sources
Data Quality: 57%