Overview
This entry corresponds to Denso's wafer fabrication operations in Toyota City, Aichi, at the former Toyota Motor Hirose Plant: Toyota's electronics and IC production site whose land, buildings, and equipment were transferred to Denso on 1 April 2020 as part of consolidating the group's electronic component operations within Denso. Toyota built the Hirose Plant as a dedicated semiconductor and electronic-components facility on a 250,000 sqm site, completed March 1989. The site produces in-vehicle semiconductors, including power semiconductors, and hosts the Toyota-Denso semiconductor JV MIRISE Technologies. Key facility details include: The facility is situated at Toyota, Aichi, Japan. It focuses on Automotive / Specialty, Automotive / Specialty on 200mm wafers. Production at this facility commenced in 1989.
Denso Semiconductor Division
Denso's internal automotive semiconductor manufacturing facilities.