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Construction EU Chips ActCzech Government

Roznov Campus - Expansion

onsemi Β· Roznov pod Radhostem, Czechia
πŸ’°
$2B
Investment
πŸ’Ώ
N/A
Wafers / Month
πŸ“…
2027
Production Start
πŸ”΅
200mm
Wafer Size

Overview

onsemi's core European SiC manufacturing facility. In 2024, the company announced a $2 billion investment to establish a state-of-the-art end-to-end SiC production hub at this site, distinct from onsemi's existing crystal/chip operations at Roznov since 2003. In November 2025, the European Commission approved EUR 450 million in Czech state aid (total investment EUR 1.64bn / ~$2bn) for the project, described as the first integrated SiC facility of its kind in the EU; industry reporting has targeted 2027 for the new hub becoming operational. Key facility details include: The facility is situated at Roznov pod Radhostem, Czechia. It focuses on Analog / Power on 200mm wafers. This site represents an estimated investment of $2B. Production at this facility is expected to begin in 2027.

Technology

onsemi

About onsemi

onsemi is driving disruptive innovation to help build a better future. With a focus on automotive and industrial end-markets, onsemi is accelerating change in high-growth applications such as vehicle electrification and industrial automation.

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