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Powertech Technology (PTI) - Main Campus

Powertech Technology Β· Hukou Township, Hsinchu County, Taiwan (Hsinchu Science Park area)
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1997
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Overview

Powertech Technology Inc. (PTI, TWSE 6239) is a Taiwanese outsourced semiconductor assembly and test (OSAT) company and the world's leading memory packaging and testing solution provider, handling DRAM and NAND flash for the major memory makers. It was founded in 1997; its Hsinpu (Hukou) plant in Hsinchu County was completed and began providing turnkey packaging and testing services in 2000, and the site has since grown into a multi-plant campus (bumping, chip probe, assembly, final test, burn-in and system-level packaging) that is the company's headquarters and its largest operation. In 2018 PTI began building a fan-out panel-level packaging (FOPLP) facility in the Hsinchu Science Park, an area it continues to expand. PTI runs over 18,000 employees with plants in Taiwan, China (a Suzhou plant acquired in 2009 and Powertech Semiconductor in Xi'an from 2015) and Japan (the former Micron Akita plant, acquired in 2017). As an OSAT it does not have a wafer-fab process node, and per-facility monthly wafer capacity and plant cost are not disclosed. Key facility details include: The facility is situated at Hukou Township, Hsinchu County, Taiwan (Hsinchu Science Park area). It focuses on Assembly & Packaging, Advanced Packaging. Production at this facility commenced in 1997.

Facility Complex

Powertech Technology (PTI)

PTI, the world's leading memory packaging and test OSAT; flagship campus at Hukou/Hsinchu with additional plants in China and Japan.

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