Overview
ROHM Hamamatsu, established July 1999 in Hamamatsu, Shizuoka, is ROHM's core front-end wafer fab for analog IC and LED front-end processing, running 8-inch (200mm) and 12-inch (300mm) lines with over 50,000 wafers/month shipped (8-inch equivalent); it achieved the world's first mass production of high-performance analog ICs using BiCDMOS process technology on 12-inch wafers, and expanded its 12-inch line starting July 2023. As of an October 2025 ROHM announcement, ROHM Hamamatsu, ROHM-Apollo, and ROHM-Wako are being reorganized (effective April 2026) into two new front-end/back-end manufacturing companies, ROHM Device Manufacturing and ROHM Assembly Manufacturing. Key facility details include: The facility is situated at Hamamatsu, Japan. It focuses on Logic / Foundry, GaN, Analog / Power on 200mm, 300mm wafers. This site represents a production capacity of 50,000 wafers per month. Production at this facility commenced in 1999.
ROHM Semiconductor
Facility Phases
Technology
About ROHM
ROHM Semiconductor is a leading provider of high-quality electronics parts and semiconductor devices. The company is a pioneer in Silicon Carbide (SiC) technology and provides essential power and analog solutions globally.