Overview
Tower Semiconductor Fab 2 in Migdal Haemek, Israel is a 200mm (8-inch) wafer fab built adjacent to Fab 1 and brought into production in 2001, representing about US$1.5 billion of investment. It runs advanced CMOS and specialty processes at 0.18-micron and 0.13-micron with a capacity of roughly 40,000 wafers per month, and was Tower's first move into 8-inch manufacturing. Key facility details include: The facility is situated at Migdal Haemek, Israel. It focuses on RF / Wireless, Sensors, Analog / Power and 180, 130 process nodes on 200mm wafers. This site represents an estimated investment of $1.5B and a production capacity of 40,000 wafers per month. Production at this facility commenced in 2001.
Tower Semiconductor Migdal Haemek
Facility Phases
Technology
About Tower Semiconductor
Tower Semiconductor Ltd. is an Israeli specialty foundry manufacturing analog/mixed-signal ICs using SiGe, BiCMOS, RF-CMOS, silicon photonics, power management, and CMOS image sensor process technologies, with fabs in Israel, Italy, and the US, plus a 51%-owned joint venture (TPSCo) with Nuvoton in Japan. Intel's proposed $5.4B acquisition of Tower was terminated in 2023 after failing to secure timely regulatory approval.