Central Taiwan Science Park Campus - Fab A / Fab B
Overview
Winbond's 12-inch (300mm) wafer fab campus at the Central Taiwan Science Park in Taichung, comprising Fab A and Fab B. Built for NT$49 billion (~US$1.5B) and entering mass production in 2006, the facility produces specialty DRAM, pseudo-SRAM, and DDR2 memory using 0.11um/90nm process technology. Key facility details include: The facility is situated at Central Taiwan Science Park, Taichung, Taiwan. It focuses on DRAM and 110, 90 process nodes on 300mm wafers. This site represents an estimated investment of $1.5B and a production capacity of 48,000 wafers per month. Production at this facility commenced in 2006.
Technology
About Winbond Electronics
Winbond Electronics is a Taiwan-based memory and logic IC maker, among the few companies worldwide with proprietary products and technology in both segments. Its specialty DRAM, NOR flash, and TrustME secure flash products serve handheld, automotive, and industrial electronics.