Kaohsiung Science Park Campus
Overview
Winbond's second 12-inch wafer fab (Module A), a 25-hectare smart manufacturing facility in Kaohsiung Science Park (Southern Taiwan Science Park, Luzhu District). Uses in-house 25nm process technology to produce specialty DRAM for IoT, AI, and industrial automation applications. Construction completed in 2020 with volume production starting in 2021. As of 2025 the fab runs at about 15,000 wafers per month, with an in-progress ramp toward roughly 24,000 wafers per month by the end of 2026. Winbond has separately announced a new Module B fab on the same site (10,000 wpm initial, 50,000 wpm at full build-out; construction from January 2027, pilot production targeted for end-2029). Key facility details include: The facility is situated at Kaohsiung Science Park, Lujhu District, Kaohsiung, Taiwan. It focuses on DRAM and 25 process nodes on 300mm wafers. This site represents a production capacity of 15,000 wafers per month. Production at this facility commenced in 2021.
Kaohsiung Science Park Campus
* This is a sum of all 2 facility phases (current & planned).
Facility Phases
Technology
About Winbond Electronics
Winbond Electronics is a Taiwan-based memory and logic IC maker, among the few companies worldwide with proprietary products and technology in both segments. Its specialty DRAM, NOR flash, and TrustME secure flash products serve handheld, automotive, and industrial electronics.