Kaohsiung Science Park Campus
Overview
Winbond's second 12-inch wafer fab, a 25-hectare smart manufacturing facility in Kaohsiung Science Park (Southern Taiwan Science Park, Lujhu District). Uses in-house 25nm process technology to produce specialty DRAM for IoT, AI, and industrial automation applications. Construction completed in 2020 with volume production starting in 2021. Key facility details include: The facility is situated at Kaohsiung Science Park, Lujhu District, Kaohsiung, Taiwan. It focuses on DRAM and 25 process nodes on 300mm wafers. Production at this facility commenced in 2021.
Technology
About Winbond Electronics
Winbond Electronics is a Taiwan-based memory and logic IC maker, among the few companies worldwide with proprietary products and technology in both segments. Its specialty DRAM, NOR flash, and TrustME secure flash products serve handheld, automotive, and industrial electronics.